@inbook {19506,
	title = {Numerical Analysis of Subcooled Convective Boiling in Microchannels},
	booktitle = {Microscale and Nanoscale Heat Transfer Analysis, Design, and Application},
	year = {2016},
	pages = {423-443},
	publisher = {CRC Press, Taylor \& Francis Group},
	organization = {CRC Press, Taylor \& Francis Group},
	address = {New York},
	abstract = {
	This chapter covers a numerical method for the resolution of the problem of subcooled convective\&nbsp;boiling flows in microchannels heat sink. The focus is on the numerical procedure for tracking or capturing\&nbsp;interface/surface shape. Fundamentals of the boiling phenomena and the thermophysical properties\&nbsp;with dimensionless numbers usually used in the resolution of the two-phase flow problems are\&nbsp;presented in Chapter 18. In particular, an analysis of the transition of phase change pattern between\&nbsp;conventional macrochannels and mini/microchannels is given in that chapter. Since the focus of this\&nbsp;chapter is the numerical modeling rather than the fundamentals of the boiling process, analysis and\&nbsp;interpretation are limited to the concerned subject. Analysis of some experimental research works in\&nbsp;the literature is also given in Chapter 18. For an in-depth understanding of fundamentals and analysis\&nbsp;of convective boiling heat transfer in microscale, readers are referred to different excellent sources\&nbsp;available in the literature. One can quote Refs. [1{\textendash}13] among a long list of interesting studies.Mini- and microchannel heat sinks have become known as one of the effective cooling techniques.\&nbsp;The advantage of such devices is their ability to dissipate large heat flux in relatively small\&nbsp;volumes, which makes them very efficient cooling systems. Mini- and microchannel heat sinks\&nbsp;combine the attributes of very high surface-area-to-volume ratio, large convective heat transfer\&nbsp;coefficient (even in single-phase flows), and small coolant fluid quantity. These attributes make\&nbsp;mini/microchannels heat sinks very suitable for cooling devices with high dissipating energy like\&nbsp;integrated circuits, microprocessors, and high-energy laser mirrors.

},
	url = {https://www.routledge.com/Microscale-and-Nanoscale-Heat-Transfer-Analysis-Design-and-Application/Rebay-Kakac-Cotta/p/book/9781498736305},
	author = {M. Rebay and G. Mebarki and N. El Wakil and A. Hamza}
}
